PCBA Process Capability
PCB Process Capability
Project
PCBA Processing Capability
| delivery time | The regular proofing delivery time is within 24 hours (the fastest is 6 hours for expedited) Delivery time for small batches within 72 hours (fastest 24 hours) Delivery time for small and medium batches within 5 days All the above time will be calculated from the next day after all components and PCB materials are ready. |
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| Capacity | SMT patch 4 million points/day, post-soldering 500,000 points/day, 50-100 models/day |
| Component service: a full set of materials | With a mature and effective component procurement management system, it serves PCBA foundry materials projects with high cost performance. A team of professional procurement engineers and experienced procurement personnel is responsible for the procurement and management of our customers' components. Customers choose our full set of substitutes, which greatly reduces procurement and management costs, eliminates the trouble of multi-party communication, and improves work effectiveness. |
| Component service: foundry only | Relying on a strong procurement management team and component supply chain, we tend to provide customers with a full set of PCBA foundry services. Of course, we are also happy to provide customers with SMT patch processing services. Customers provide us with components and PCB light boards, and we solder them after mounting. In order to ensure the quality of the finished product, all of our PCBAs are mounted on the machine, and the customer supply must be guaranteed to be packaged in trays, tapes and other packages. |
| Component Service: Partial Substitution | Some customers' core components or special components are provided by customers. We are happy to provide customers with other components' material substitution services. Customer convenience is our work guideline. |
| PCBA welding type | We provide surface mount (SMT), post-insertion (THT) or both PCBA soldering services. Of course, double-sided patching is the most basic ability. |
| Solder paste / tin wire / tin bar | We provide customers with lead and lead-free (RoHS compliant) patch processing services. At the same time, we also provide customized solder paste soldering services with different metal contents according to customer requirements. We have maintained close cooperation with solder suppliers such as Qianzhu and Alpha for a long time, only for higher quality requirements, and customers have demand, we can do it! |
| Steel mesh | We use laser stencils to ensure that the small-pitch IC and BGA components meet IPC-2 Class or higher standards. |
| Minimum order | We start with 1 piece, but we recommend that our customers produce at least 5 samples for their own analysis and testing. |
| Component size | • Passive components: We are good at mounting inch size 01005 (0.4mm * 0.2mm), 0201 components. • High-precision IC such as BGA: We can detect BGA components with a Min 0.25mm pitch through X-ray. |
| Component packaging | We accept SMT components in reels, cutting tapes, tubes and pallets that can be packaged on the machine. Back-welded components are accepted in bulk. |
| Maximum component placement accuracy (100FP)span> | The whole placement accuracy is 0.0375mm |
| Can be pasted PCB board type | PCB rigid board (FR-4, metal substrate), PCB soft board (FPC), soft and hard combined PCB, aluminum substrate |
| SMT board size | •Minimum board size: 50mm x 50mm (boards smaller than this size need to be joined together, in order to improve efficiency, it is recommended to be larger than 100mm * 100mm •Maximum board size: 400mm x 1200mm (the largest processing size in the industry) |
| Maximum thickness | Thickness 0.3mm ~4.5mm |
| File format | Bill of Materials (BOM), PCB (Gerber files and most PCB design format files), coordinate files) |
| Test | Before delivery, we will apply various test methods to PCBA that is being mounted or already mounted: • IQC: incoming inspection; • IPQC: In-production inspection, the first LCR test; • Visual QC: routine quality inspection; • SPI inspection: automatic solder paste optical inspection • AOI: welding effect of SMD components, few pieces or component polarity; • X-Ray: Check BGA, QFN and other high-precision hidden PAD components; • Functional test: In accordance with the customer's test procedures and procedures, test functions and performance to ensure compliance with requirements. |
| Repair & rework | Our BGA rework service can safely remove defective BGAs such as misalignment, offset, and false soldering, and reattach them to the PCB perfectly. |
Project
Processing Capacity
Detailed Process
| Number of layers | 1-6 layers | The number of layers refers to the number of layers of the design file, which can produce through-hole boards with 1-6 layers |
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| Ink | Sun series | White oil: Sun 2000 series, green oil: Sun 07 series |
| Plate type | FR-4 | FR-4（Kingboard） |
| Biggest size | 650x520mm/640x480mm | The maximum size of single and double sides is 650x520mm, the maximum size of four or six layers is 640x480mm |
| Dimensional accuracy | ±0.15mm | CNC shape tolerance ±0.15mm, V-cut board shape tolerance ±0.15mm |
| Board thickness range | 0.2-2.4mm | Current production thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4 mm |
| Board thickness tolerance (t≥1.0mm) | ± 10% | Please pay attention to this point: due to the production process (copper sinking, solder mask, pad spraying will increase the thickness of the board), the general tolerance is normal |
| Board thickness tolerance (t<1.0mm) | ±0.1mm | Please pay attention to this point: due to the production process (copper sinking, solder mask, pad spraying will increase the thickness of the board), the general tolerance is normal |
| Minimum line width | 4mil（0.1mm） | At present, 4mil line width can be connected, and the line width should be greater than 4mil as much as possible |
| Minimum gap | 4mil（0.1mm） | At present, 4mil line spacing can be connected, and the gap should be greater than 4mil as much as possible |
| Finished copper thickness | 35um/70um（1 OZ/2 OZ） | Refers to the thickness of the outer circuit copper foil of the finished circuit board, 1 OZ=35um, 2 OZ=70um |
| Finished inner copper thickness | 35um | All inner layers are made with 1 OZ |
| Drilling hole diameter (machine drill) | 0.25mm--6.3mm | 0.25mm is the minimum hole diameter of the drill hole, 6.3mm is the maximum hole diameter of the drill hole, if it is larger than 6.3mm, the factory will process it separately |
| Through hole single side welding ring | ≥0.153mm（6mil） | If the solder ring on one side of the conductive hole or plug-in hole is too small, but there is enough space there, the size of one side of the solder ring is not limited; if there is not enough space and there are dense wiring, the smallest single side The welding ring shall not be less than 0.153mm |
| Finished hole diameter (machine drill) | 0.25mm--6.5mm | Due to the metal copper attached to the inner wall of the hole, the diameter of the finished hole is generally smaller than the hole diameter in the file |
| Aperture tolerance (machine drill) | ±0.075mm | The tolerance of the drilling hole is ±0.075mm, for example, the hole designed as 0.6mm, the finished hole diameter of the physical board is 0.525-0.675mm is qualified and allowed |
| Solder mask type | Photosensitive ink | Photosensitive ink is the most used type now, thermosetting oil is generally used in low-grade single-sided cardboard |
| Minimum character width | ≥0.15mm | The minimum width of the characters, if it is less than 0.15mm, the physical board may cause unclear characters due to design reasons |
| Minimum character height | ≥0.8mm | The minimum height of the characters, if it is less than 0.8mm, the physical board may cause unclear characters due to design reasons |
| Character aspect ratio | 1:5 | The most suitable width to height ratio is more conducive to production |
| Distance between trace and shape | ≥0.3mm（12mil） | For gong board shipment, the distance between the wiring of the circuit layer and the outline line of the board shall not be less than 0.3mm; for V-cut panel shipment, the distance between the wiring and the V-cut center line shall not be less than 0.4mm |
| Imposition: no gap imposition gap | 0 gap fight | It is an imposition shipment, the gap between the middle board and the board is 0 (the document has detailed explanation) |
| Imposition: there is a gap between the imposition gap | 1.6mm | There is a gap. The gap of the imposition should not be less than 1.6mm, otherwise it will be more difficult to use the gong. |
| Pads factory copper laying method | Hatch way copper | The manufacturer uses restore copper, customers who use pads to design this item must pay attention |
| Picture slot in Pads software | Use Drill Drawing layer | If there are more non-metallic grooves on the board, please draw on the Drill Drawing layer |
| Window layer in Protel/dxp software | Solder layer | A few engineers mistakenly placed the paste layer and did not deal with the paste layer |
| Protel/dxp shape layer | Use Keepout layer or mechanical layer | Please note: only one shape layer is allowed in a file, and two shape layers are never allowed to exist at the same time. Please delete the unused shape layer, that is: when drawing the shape, you can only choose one of the Keepout layer or the mechanical layer. |
| Half hole process | Minimum half hole diameter 1.0mm No more than 10 | Half hole process is a special process, the minimum hole diameter shall not be less than 1.0mm |
| Solder mask bridge | 0.1mm | If there is a solder mask bridge requirement, it must be noted! The price of the solder mask bridge will rise according to the process requirements. If the solder mask color is green, red, blue, the pitch between the pads must be ≥8mil; the pitch of other colors must be ≥10mil |